Impact of ball via configurations on solder joint reliability in tape-based, chip-scale packages

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) Pub Date : 2002-08-07 DOI:10.1109/ECTC.2002.1008301

B. Zahn

{"title":"Impact of ball via configurations on solder joint reliability in tape-based, chip-scale packages","authors":"B. Zahn","doi":"10.1109/ECTC.2002.1008301","DOIUrl":null,"url":null,"abstract":"Three-dimensional finite element analysis has been applied to determine the time-dependent solder joint fatigue response of a tape based chip-scale package under accelerated temperature cycling conditions (-40C to +125C, 15min ramps/15min dwells). The effects of differing ball via configurations due to variations in both package assembly and tape vendors were investigated, including the use of punched, etched, laser etched, and enhanced re-flow pad area vias. The solder structures accommodate the bulk of the plastic strain that is generated during accelerated temperature cycling due to the thermal expansion mismatch between the various materials that encompass the chip-scale package. Since plastic strain is a dominant parameter that influences low-cycle fatigue, it was used as a basis for evaluation of solder joint structural integrity. An extensively published and correlated solder joint fatigue life prediction methodology was incorporated by which finite element simulation results were translated into estimated cycles to failure. This study discusses the analysis methodologies as implemented in the ANSYS finite element simulation software tool.","PeriodicalId":285713,"journal":{"name":"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"59","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2002.1008301","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 59

Abstract

Three-dimensional finite element analysis has been applied to determine the time-dependent solder joint fatigue response of a tape based chip-scale package under accelerated temperature cycling conditions (-40C to +125C, 15min ramps/15min dwells). The effects of differing ball via configurations due to variations in both package assembly and tape vendors were investigated, including the use of punched, etched, laser etched, and enhanced re-flow pad area vias. The solder structures accommodate the bulk of the plastic strain that is generated during accelerated temperature cycling due to the thermal expansion mismatch between the various materials that encompass the chip-scale package. Since plastic strain is a dominant parameter that influences low-cycle fatigue, it was used as a basis for evaluation of solder joint structural integrity. An extensively published and correlated solder joint fatigue life prediction methodology was incorporated by which finite element simulation results were translated into estimated cycles to failure. This study discusses the analysis methodologies as implemented in the ANSYS finite element simulation software tool.

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在基于磁带的芯片级封装中，球孔结构对焊点可靠性的影响

在加速温度循环条件下(-40°c至+125°c, 15min斜坡/15min停留)，采用三维有限元分析确定了基于带状芯片级封装的焊点疲劳响应随时间的变化。研究人员研究了由于封装组装和胶带供应商的不同而导致的不同球孔结构的影响，包括使用穿孔、蚀刻、激光蚀刻和增强回流垫面积的过孔。在加速温度循环过程中，由于包含芯片级封装的各种材料之间的热膨胀不匹配而产生的大部分塑性应变，焊料结构可以容纳。由于塑性应变是影响低周疲劳的主要参数，因此将其作为评价焊点结构完整性的依据。一个广泛发表和相关的焊点疲劳寿命预测方法被纳入其中，有限元模拟结果转化为估计周期失效。本研究讨论了在ANSYS有限元仿真软件工具中实现的分析方法。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)

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