Cu-based alloys for 3DP by melt extrusion process

Abstract

A feasible method to extrude Cu-based alloys by a high-temperature melt-extrusion (ME) module and the property characterization of Cu-Zn alloys were conducted. The ME module assembled on 3D Printer (3DP) had different designs from traditional 3DP. The module for 3DP applications has superior characteristics, such as 1100°C-extrusion capability, high heating rate (930 °C/ 5 min), good thermal insulation, compact and light weight. Various Cu-based alloys, i.e. Cu-Zn alloys, were selected and prepared as the feedstock filaments for the ME 3DP. Oxidation kinetics of 8020 Cu-Zn alloy, pure Cu, and other metallic alloys were investigated and compared to that in N2 atmosphere. Besides, the electric conductivity is reported and discussed.