Solid phase, high flux cooling of electronic equipment

W. Alexander, R. Alexander
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引用次数: 1

Abstract

The use of solid materials in the form of thin foils for high flux cooling of electronic equipment is presented. The Foil And Slot Thermal (FAST) Conveyor is a new approach to heat transfer using thin solid foils running in narrow slots. Thermal fluxes above 150Wcm−2 are conservatively predicted with 20C foil to slot temperature differences at ambient temperatures between −40C to above 250C and over 2000Wcm−2 for refrigerated cooling systems. Theoretical models predict flux levels above 100Wcm−2 even at 100K. Prototypes using the same core technology in various configurations have been built and tested. Preliminary results from these experiments are discussed which indicate the potential of the new technology for high heat flux, wide operating temperature applications.
电子设备的固相高流量冷却
介绍了如何利用薄金属箔形式的固体材料对电子设备进行高通量冷却。箔片和狭槽热力(FAST)传送带是一种利用在狭槽中运行的薄固体箔片进行热传递的新方法。根据保守预测,在环境温度介于 -40C 至 250C 以上时,箔与槽温差为 20C 时,热通量将超过 150Wcm-2;在冷冻冷却系统中,热通量将超过 2000Wcm-2。理论模型预测,即使在 100K 的温度下,通量也会超过 100Wcm-2。采用相同核心技术的各种配置的原型已经制造完成并进行了测试。对这些实验的初步结果进行了讨论,这些结果表明新技术在高热通量、宽工作温度应用方面的潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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