Development of OE integrated surface mount packaging

Abstract

In an effort to provide a breakthrough in next-generation fiber optic data links, we are proposing a concept in optics and electronics (OE) integrated surface mount packaging technology. It can provide more compact and easier assembly of optoelectronics packaging. One assembly issue of surface mount packaging is being able to secure high bit rate transmission lines from board level to optics mount level as well as optical connectivity on the board. In this paper, we describe how a flat lead type surface mount package utilizing RF vias, which has broadband characteristics and provides high performance, low distortion of the pulse waveform, and low jitter, from active devices. For a demonstration, we evaluated actual EO modules using 2 mm length RF vias, enabling a receptacle such as an SC type to be attached. Measurement results of electrical/optical eye diagram tests were very close to the theoretical expectations. Therefore, we believe that the technology is a positive solution to develop downsizing and mass-productivity of optoelectronics packaging.