Total power optimization combining placement, sizing and multi-Vt through slack distribution management

T. Luo, D. Newmark, D. Pan
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引用次数: 21

Abstract

Power dissipation is quickly becoming one of the most important limiters in nanometer IC design for leakage increases exponentially as the technology scaling down. However, power and timing are often conflicting objectives during optimization. In this paper, we propose a novel total power optimization flow under performance constraint. Instead of using placement, gate sizing, and multiple-Vt assignment techniques independently, we combine them together through the concept of slack distribution management to maximize the potential for power reduction. We propose to use the linear programming (LP) based placement and the geometric programming (GP) based gate sizing formulations to improve the slack distribution, which helps to maximize the total power reduction during the Vt-assignment stage. Our formulations include important practical design constraints, such as slew, noise and short circuit power, which were often ignored previously. We tested our algorithm on a set of industrial-strength manually optimized circuits from a multi-GHz 65 nm microprocessor, and obtained very promising results. To our best knowledge, this is the first work that combines placement, gate sizing and Vt swapping systematically for total power (and in particular leakage) management.
通过松弛分布管理,实现布局、尺寸和多vt相结合的总功率优化
在纳米集成电路设计中,功耗正迅速成为最重要的限制因素之一,因为随着技术规模的缩小,泄漏会呈指数级增长。然而,在优化过程中,功率和时间往往是相互冲突的目标。本文提出了一种新的性能约束下的总功率优化流程。我们不是单独使用布局、栅极尺寸和多电压分配技术,而是通过松弛分布管理的概念将它们结合在一起,以最大限度地降低功率的潜力。我们建议使用基于线性规划(LP)的布局和基于几何规划(GP)的栅极尺寸公式来改善松弛分布,这有助于在vt分配阶段最大限度地降低总功率。我们的公式包含了重要的实际设计约束,如摆压、噪声和短路功率,这些在以前经常被忽略。我们在一组多ghz 65nm微处理器的工业强度人工优化电路上测试了我们的算法,并获得了非常有希望的结果。据我们所知,这是第一次将放置、栅极尺寸和Vt交换系统地结合在一起,以实现总功率(特别是泄漏)管理。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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