Mindel® B resins - new options in thermoset replacement in electrical/electronic devices

Abstract

To understand why there has been such a recent flurry of activity on the part of resin suppliers, why there have been so many new products introduced, one needs only to examine what's happening in the electronic industry—particularly in the area of interconnects. The list of emerging new technologies that are rapidly changing the essence of this industry includes entries such as surface mount technology, fiber optics, very high speed integrated circuits, automatic insertion, and high density interconnects (with as many as 684 pins). These new advances bring with them new demands such as resistance to 419°F vapors, thin wall moldability, more accurate hole registration, and flatness over lengths as long as 18 inches. It is in response to these demands that we in the plastics industry are developing and introducing so many new products.