EMI modeling and simulation in the IC design process

T. Steinecke, D. Hesidenz, E. Miersch
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引用次数: 22

Abstract

The power integrity of the system chip plus chip package determines the RF emission potential and is thus a key quality parameter of complex integrated circuits like microcontrollers for automotive applications. However, modeling and simulation of power integrity and thus electromagnetic emission must be applied as early as possible in the IC design process. This paper presents two approaches: (1) the case study simulation in a very early IC design phase and (2) the accurate netlist/layout-based simulation at a later design phase. Both implementations have been used in combination with the Infineon 32-bit microcontroller TC1796
集成电路设计过程中的电磁干扰建模与仿真
系统芯片加上芯片封装的功率完整性决定了射频发射电位,因此是汽车应用微控制器等复杂集成电路的关键质量参数。然而,在集成电路设计过程中,必须尽早应用电源完整性和电磁发射的建模和仿真。本文提出了两种方法:(1)在非常早期的IC设计阶段进行案例研究仿真,(2)在后期设计阶段进行精确的基于网表/布局的仿真。这两种实现都与英飞凌32位微控制器TC1796结合使用
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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