{"title":"On-chip patch antenna on InP substrate for short-range wireless communication at 140 GHz","authors":"Yunfeng Dong, T. Johansen, V. Zhurbenko","doi":"10.1109/IMOC.2017.8121032","DOIUrl":null,"url":null,"abstract":"This paper presents the design of an on-chip patch antenna on indium phosphide (InP) substrate for short-range wireless communication at 140 GHz. The antenna shows a simulated gain of 5.3 dBi with 23% bandwidth at 140 GHz and it can be used for either direct chip-to-chip communication or chip-level integration and packaging. In the transmission frequency band from 130 GHz to 150 GHz the estimated in-band gain variation is 0.5 dBi which guarantees gain uniformity. The antenna with optimized dimension is implemented for a transition between elevated coplanar waveguide (ECPW) and rectangular waveguide. The chip-to-waveguide transition in back-to-back configuration exhibits a simulated return loss of 10 dB and insertion loss of 3 dB from 128 GHz to 153 GHz. For higher directivity, a horn antenna is used together with the chip-to-waveguide transition forming an extended packaging structure that is suitable for the transceiver (Tx and Rx) chips. The simulated gain of the extended packaging structure is 11.9 dBi with 23% bandwidth at 140 GHz and the in-band gain variation is 2 dBi.","PeriodicalId":171284,"journal":{"name":"2017 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference (IMOC)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference (IMOC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMOC.2017.8121032","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
This paper presents the design of an on-chip patch antenna on indium phosphide (InP) substrate for short-range wireless communication at 140 GHz. The antenna shows a simulated gain of 5.3 dBi with 23% bandwidth at 140 GHz and it can be used for either direct chip-to-chip communication or chip-level integration and packaging. In the transmission frequency band from 130 GHz to 150 GHz the estimated in-band gain variation is 0.5 dBi which guarantees gain uniformity. The antenna with optimized dimension is implemented for a transition between elevated coplanar waveguide (ECPW) and rectangular waveguide. The chip-to-waveguide transition in back-to-back configuration exhibits a simulated return loss of 10 dB and insertion loss of 3 dB from 128 GHz to 153 GHz. For higher directivity, a horn antenna is used together with the chip-to-waveguide transition forming an extended packaging structure that is suitable for the transceiver (Tx and Rx) chips. The simulated gain of the extended packaging structure is 11.9 dBi with 23% bandwidth at 140 GHz and the in-band gain variation is 2 dBi.