A substructure method for strip level warpage simulation of a power module in assembly process

Abstract

A substructural method is developed to simulate the strip level warpage of a power module in assembly process. The comparison between substructure and non-substructure methods is presented and discussed. Parametric design of experimental (DoE) study on low side (LS) and high side (HS) die thickness, epoxy mold compound (EMC) thicknenss, as well the Young's modulus Ez of prepreg and Young's modulus of EMC is conducted in the simulation.