Optimizing antenna voltage balancing for remote helical ICP plasma discharge using Oxygen, Hydrogen, Nitrogen, Ammonia and their mixtures : AEPM: Advanced Equipment Processes and Materials

Abstract

Inductively coupled plasma technology is widely used for photoresist strip processes in the modern semiconductor industry. We examined plasma discharge behavior according to various gas mixtures and end capacitance values. Antenna voltage and plasma impedance were measured during plasma discharge. Plasma harmonic was experimentally compared by adjusting the antenna balance. We report the experimental results which reveal that the changes in antenna voltage is associated with the applied gases and their mixing ratio.