Automated direct patterned wafer inspection

Abstract

A self-reference technique is developed for detecting the location of defects in repeated pattern wafers and masks. The application area of the proposed method includes inspection of memory chips, shift registers, switch capacitors, and CCD arrays. Using high resolution spectral estimation algorithms, the proposed technique first extracts the period and structure of repeated patterns from the image to sub-pixel resolution, and then produces a defect-free reference image for making comparison with the actual image. Since the technique acquires all its needed information from a single image, there is no need for a database image, a scaling procedure, or any a-priori knowledge about the repetition period of the patterns.<>