Integrating thermocouple sensors into 3D ICs

Dawei Li, Ji-hoon Kim, S. Memik
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引用次数: 9

Abstract

In this paper, we present a novel architecture for embedding bi-metallic thermocouple based temperature sensors into 3D IC stacks. To the best of our knowledge this is the first work addressing this specific integration problem. Our architecture uses dedicated vias to thermally couple sensors in the metal layer with the hotspots to be monitored in the active layer throughout the multi-stack structures. We propose a low cost solution by leveraging a fraction of existing thermal TSVs for this purpose. Through thermal modeling and simulation using a state-of-the-art tool (FloTHERM), we demonstrate that we can achieve high accuracy (less than 1°C error) in temperature tracking while still maintaining the effectiveness of the thermal TSVs in heat management (conforming to a fixed peak temperature threshold of 95°C).
集成热电偶传感器到3D集成电路
在本文中,我们提出了一种新的架构,用于将基于双金属热电偶的温度传感器嵌入到3D集成电路堆栈中。据我们所知,这是解决这个特定集成问题的第一个工作。我们的架构使用专用通孔来连接金属层中的热电偶传感器,并在整个多层结构的有源层中监测热点。我们提出了一种低成本的解决方案,利用现有热tsv的一小部分来实现这一目的。通过使用最先进的工具(FloTHERM)进行热建模和仿真,我们证明了我们可以在温度跟踪中实现高精度(误差小于1°C),同时仍然保持热tsv在热管理中的有效性(符合95°C的固定峰值温度阈值)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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