Failure Mechanism and Simulation of Gate Wrong Turn-on for IGBT in the Off State

Yong Tang, Bo Wang, Yonghong Chen
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Abstract

When IGBT in the off state is subjected to certain voltage changes, internal junction capacitor charging will generate displacement current, which will cause gate voltage to rise and even exceed threshold voltage value, leading to wrong turn-on of IGBT. In serious cases, it will cause short circuit and cause device failure. Based on the existing Hefner model of IGBT, the failure mechanism of IGBT is studied and the formula is deduced from semiconductor physics. the expression of displacement current is obtained, and the displacement current caused by the change of capacitance itself is added. Finally, the correctness of the analysis is verified by simulation.
IGBT关断状态下栅极错误导通失效机理及仿真
当处于关断状态的IGBT受到一定电压变化时,内部结电容充电会产生位移电流,使栅极电压上升,甚至超过阈值电压,导致IGBT错误导通。严重时,会引起短路,导致设备故障。在现有的Hefner模型的基础上,研究了IGBT的失效机理,并从半导体物理学的角度推导了IGBT的失效公式。得到了位移电流的表达式,并加入了电容本身变化引起的位移电流。最后,通过仿真验证了分析的正确性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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