A 6-bit, 4 GSa/s ADC fabricated in a GaAs HBT process

K. Poulton, K. Knudsen, J. Corcoran, K. C. Wang, R. Nubling, R. Pierson, M. Chang, P. Asbeck, R. Huang
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引用次数: 28

Abstract

A GaAs-AlGaAs Heterojunction Bipolar Transistor (HBT) process was developed to meet the speed, gain and yield requirements for Analog to Digital Converters (ADCs). A 6-bit, 4 GSa/s (4 giga-samples per second) ADC was designed and fabricated in this process. The standard HBT used has an emitter area of 1.4/spl times/3.0 /spl mu/m; it has current gain of over 70 at I/sub c/=1 mA and f/sub T/ and f/sub MAX/ of over 50 GHz at I/sub c/=4 mA. The process also includes Schottky diodes, thin-film NiCr resistors, MIM capacitors and three levels of metal interconnect. The ADC uses an analog folding architecture to reduce transistor count and power well below that of a straight 6-bit flash ADC. It includes an on-chip track-and-hold (T/H) circuit and Gray-encoded digital outputs for best immunity to dynamic errors. The ADC's measured differential nonlinearity is less than /spl plusmn/0.5 LSB and its integral nonlinearity is less than /spl plusmn/0.8 LSB. It has a resolution bandwidth (the frequency at which effective bits has dropped by 0.5 bits) of 2.4 GHz at 3 GSa/s and 1.8 GHz at 4 GSa/s, higher than any ADC published to date. The chip operates at up to 6.5 GSa/s, but linearity at that clock rate is much worse.
采用GaAs HBT工艺制作的6位4gsa /s ADC
为了满足模数转换器(adc)的速度、增益和良率要求,开发了一种GaAs-AlGaAs异质结双极晶体管(HBT)工艺。在此过程中设计并制作了一个6位,4 GSa/s(4千兆采样每秒)的ADC。使用的标准HBT发射极面积为1.4/spl倍/3.0 /spl亩/米;在I/sub c/=1 mA时电流增益超过70,在I/sub c/=4 mA时电流增益超过50 GHz。该工艺还包括肖特基二极管、薄膜NiCr电阻器、MIM电容器和三级金属互连。ADC采用模拟折叠架构,以减少晶体管数量和功耗,远低于直接6位闪存ADC。它包括一个片上跟踪和保持(T/H)电路和灰度编码数字输出,以最佳地抵抗动态误差。ADC的实测微分非线性小于/spl plusmn/0.5 LSB,积分非线性小于/spl plusmn/0.8 LSB。它的分辨率带宽(有效位下降0.5位的频率)在3gsa /s时为2.4 GHz,在4gsa /s时为1.8 GHz,高于迄今为止发布的任何ADC。该芯片的工作速度高达6.5 GSa/s,但在该时钟速率下的线性度要差得多。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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