ANALISA CYCLIC VOLTAMMETRY GUNA RECOVERY TEMBAGA PADA LIMBAH ELEKTRONIK PRINTED CIRCUIT BOARDS (PCB) MENGGUNAKAN RELINE

Ebeng Sugondo, Andy Wijaya, Aan Subekti Proklamanto, Fedika Gita Reziana, Fatiha Nur Etnanta
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Abstract

Cyclic voltammetry analysis for copper recovery on printed circuit boards (PCB) electronic waste using Reline (ChCl: Thiourea) has been successfully carried out. The use of Reline solution (ChCl: Thiourea) is included in the deep eutectic solvent (DES) as an alternative for the use of solvents that are cheap, efficient, and safe for the environment. The solvent is formed from a donor (HBD) and acceptor (HBA) bonds with a ratio of 1 mol: 2 mol to water which will produce a eutectic mixture. The results of XRF (X-ray fluorescence spectrometry) on the printed circuit board (PCB) after comminution obtained the highest element, namely copper at 17.91%, and became the object of research observation. All experiments on the cyclic voltammetry test produced irreversible type voltammograms. The addition of more than 50% water in the deep eutectic solvent (DES) affects the peaks of oxidation and reduction, and in theory, the current efficiency is 99.83% and the optimum test results occur at a temperature of 60 oC for testing the Reline type deep eutectic solvent (DES) solution (ChCl: Thiourea) with a potential of Ep = 4.2975 volts and Ep/2 = 4.2971 volts. SEM-EDX analysis results on a platinum plate (Pt) from deep eutectic solvent (DES) ChCl: Thiourea (Reline) capable of spontaneously depositing copper minerals onto the surface of the platinum plate (Pt). Keywords: Reline, Cyclic Voltammetry, Solvent
分析循环伏安法回收tembaga帕达林巴电子印刷电路板(pcb)蒙古纳坎线
成功地用氯化硫脲(Reline ChCl: Thiourea)循环伏安法分析了印刷电路板(PCB)电子废弃物中的铜。深共晶溶剂(DES)中包含了Reline溶液(ChCl: Thiourea)的使用,作为使用廉价、高效且对环境安全的溶剂的替代方案。溶剂由供体(HBD)和受体(HBA)键形成,与水的比例为1mol: 2mol,形成共晶混合物。在粉碎后的印刷电路板(PCB)上进行XRF (x射线荧光光谱分析)的结果得到了最高的元素,即铜,含量为17.91%,成为研究观察的对象。循环伏安法试验的所有实验都产生不可逆型伏安图。在深度共晶溶剂(DES)中加入50%以上的水会影响氧化还原峰,理论上电流效率为99.83%,测试电位为Ep = 4.2975伏、Ep/2 = 4.2971伏的Reline型深度共晶溶剂(DES)溶液(ChCl: Thiourea)的最佳测试温度为60℃。SEM-EDX分析结果表明,深共熔溶剂(DES)对铂板(Pt)的ChCl: Thiourea (Reline)能够在铂板(Pt)表面自发沉积铜矿物。关键词:线,循环伏安法,溶剂
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