Novel Packaging Approach for Thick Film Based Gas Sensors and Associated Aspects

Abstract

Packaging of gas sensor presents various challenges as traditional approach results in the degradation of the sensor performance. The additional challenge of high temperature linked with the integrated heater put additional constraint on the various attachment materials such as epoxies, film adhesives apart from the selection of the package keeping into consideration of thermal and associated aspects. In this article we adopted novel packaging methodology of providing additional cushion for low thermal dissipation along with mesh on the top to achieve better sensitivity. The effect of packaging on the heater performance is also analyzed and presented. Attachment with high temperature epoxy, interactive openings using mesh structure, usage of metallic and non-metallic mesh, bonding process for high current operations are the additional features adopted in this approach and are detailed in this article.