Fabrication of affordable metallic microstructures by electroplating and photoresist molds

B. Ghodsian, A. Parameswaran, M. Syrzycki, N. Tait
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引用次数: 2

Abstract

Electroforming processes such as electroplating was used in conjunction with photoresist mold to fabricate surface and substrate micromachined structure. Gold, gold alloys and nickel and nickel-iron alloys were used as structural material in this technique. In case of surface micromachining free standing, cantilevers, bridges and linear and torsional comb drives on silicon substrate were fabricated, whereas in case of substrate micromachined magnetic actuators were fabricated using the above mentioned technology. The thickness of metallic microstructures varied from 8 /spl mu/m to 20 /spl mu/m. This presentation discusses the technology we have developed in our laboratory to fabricate affordable metallic microstructures, as well as presenting functional devices we have built to demonstrate the potential of this technology.
用电镀和光刻胶模具制造廉价的金属微结构
电铸工艺(如电镀)与光刻胶模具相结合用于制造表面和衬底微机械结构。该技术采用金、金合金、镍和镍铁合金作为结构材料。在表面微加工中,采用自由支架制造悬臂梁、桥架和硅衬底上的线状和扭转梳状驱动器,而在衬底微加工中采用上述技术制造磁致动器。金属微结构厚度在8 ~ 20个/spl mu/m之间变化。这次演讲讨论了我们在实验室开发的制造价格合理的金属微结构的技术,以及展示我们已经建造的功能设备,以展示这项技术的潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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