{"title":"Thermal Test of Mobile Devices in Normal Use","authors":"P. J. Varga, Andras Kalecz, Zsolt Illési","doi":"10.1109/SACI.2018.8440951","DOIUrl":null,"url":null,"abstract":"Mobile devices, such as smartphones, tablets and other wearable technologies become integral part of our everyday life. Besides software development of these devices, the used hardware is evolving rapidly. To satisfy the ever increasing requirements of the users, the manufacturers improving the system architecture and the performance of the hardware components. These complex architectures are supporting mobile gaming, online video streaming, recording videos in full HD, etc. Consequently, the performance of the today's mobile devices match with the performance of the yesterday's desktop devices. The energy consumption of these mobile devices is increase, and as a result, users can observe excessive heating in some pieces of these devices. Device designers, in an ideal situation, take into account heating, and the resulting technological issues and the inconvenient thermal-ergonomic sensation. The elevated temperature of handheld devices not only cause inconvenience, but also lead to equipment failure. This paper introduce the results of a series of initial thermal analysis of some mobile devices. Although, the tests in this paper are just the introduction of some early analysis, they are not comprehensive. In spite of this, the results highlight the need of further thermal study of the mobile devices. [1]","PeriodicalId":126087,"journal":{"name":"2018 IEEE 12th International Symposium on Applied Computational Intelligence and Informatics (SACI)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE 12th International Symposium on Applied Computational Intelligence and Informatics (SACI)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SACI.2018.8440951","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Mobile devices, such as smartphones, tablets and other wearable technologies become integral part of our everyday life. Besides software development of these devices, the used hardware is evolving rapidly. To satisfy the ever increasing requirements of the users, the manufacturers improving the system architecture and the performance of the hardware components. These complex architectures are supporting mobile gaming, online video streaming, recording videos in full HD, etc. Consequently, the performance of the today's mobile devices match with the performance of the yesterday's desktop devices. The energy consumption of these mobile devices is increase, and as a result, users can observe excessive heating in some pieces of these devices. Device designers, in an ideal situation, take into account heating, and the resulting technological issues and the inconvenient thermal-ergonomic sensation. The elevated temperature of handheld devices not only cause inconvenience, but also lead to equipment failure. This paper introduce the results of a series of initial thermal analysis of some mobile devices. Although, the tests in this paper are just the introduction of some early analysis, they are not comprehensive. In spite of this, the results highlight the need of further thermal study of the mobile devices. [1]