Electron and Phonon Tranports in a 3D FinFET Transistor

Sirine Glaied, F. Nasri, M. Machhout
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Abstract

The switch from planar MOSFET to 3-D FinFET technology is one of the best choices to enhance electric performance, even though this switch could damage the transistor due to Self-Heating effect (SHE). In this paper, an electro-thermal model is developed by combining the ballistic-diffusive equation or BDE-model and the drift-diffusion (D-D) model to evaluate the electric and thermal aspects of 14-nm Bulk and SOI FinFET devices. By giving comparisons of the IDS-VGS aspects of our presented work with experimental results reported by HP and INTEL laboratories and numerical data given by TCAD simulators, the validity of the electrical part is verified. Thermal results are also improved by giving comparisons of our thermal characteristics with those obtained by TCAD simulators. The results analysis reveals that the temperature rises slowly in the case of Bulk FinFET comparing to SOI FinFET.
三维FinFET晶体管中的电子和声子输运
从平面MOSFET切换到三维FinFET技术是提高电性能的最佳选择之一,尽管这种切换可能会由于自热效应(SHE)而损坏晶体管。本文结合弹道扩散方程(bde)模型和漂移扩散(D-D)模型建立了电热模型,以评估14nm Bulk和SOI FinFET器件的电学和热方面。通过将本文工作的IDS-VGS方面与HP和INTEL实验室报告的实验结果以及TCAD模拟器给出的数值数据进行比较,验证了电气部分的有效性。通过将我们的热特性与TCAD模拟器获得的热特性进行比较,热结果也得到了改进。结果分析表明,与SOI FinFET相比,Bulk FinFET的温度上升速度较慢。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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