Thermal stresses in the bulk and epitaxial growth of III-V materials

A. S. Jordan, R. Caruso
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Abstract

Summary form only given. Large temperature gradients and substantial differences in thermal expansion coefficients are among the major factors for thermal stress generation in many materials systems. The field of electronic materials provides striking illustrations with regard to the role of thermal stress in crystal growth. In the LEC (liquid encapsulation Czochralski) growth of GaAs and InP, the current understanding of dislocation generation is based on the quasi-steady state (QSS) heat transfer/thermal stress model. The theory not only yields correctly the observed dislocation patterns of
III-V材料的体热应力和外延生长
只提供摘要形式。在许多材料体系中,较大的温度梯度和较大的热膨胀系数差异是产生热应力的主要因素。关于热应力在晶体生长中的作用,电子材料领域提供了引人注目的例证。在GaAs和InP的LEC(液体包封Czochralski)生长中,目前对位错产生的理解是基于准稳态(QSS)传热/热应力模型。该理论不仅正确地得出了观察到的位错模式
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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