Effects of underfill encapsulant on the mechanical and electrical performance of a functional flip chip device

Abstract

The curing conditions and material properties such as the coefficient of thermal expansion, glass transition temperature, Young's modulus, and moisture content of four different underfill encapsulants with different size and content of filler and epoxy are measured. The effects of these underfills on the flow rate, mechanical performance, and electrical performance of a solder-bumped functional flip chip on an organic substrate are studied.