The impact of fin/sidewall/gate line edge roughness on trapezoidal bulk FinFET devices

Wen-Tsung Huang, Yiming Li
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引用次数: 8

Abstract

In this work, the DC characteristic variability of 14-nm-gate HKMG trapezoidal bulk FinFET induced by different line edge roughness (LER) is for the first time studied by using experimentally validated 3D device simulation. By considering a time-domain Gaussian noise function, we compare four types of LER: Fin-LER inclusive of resist-LER and spacer-LER, sidewall-LER, and gate-LER for the trapezoidal bulk FinFET with respect to different fin angles. The resist-LER and sidewall-LER have large impact on characteristics fluctuation. For each type of LER, the Vth fluctuation is comparable among fin angles.
翅片/侧壁/栅极线边缘粗糙度对梯形体FinFET器件的影响
本文首次采用实验验证的三维器件仿真方法,研究了不同线边缘粗糙度(LER)对14nm栅极HKMG梯形体FinFET直流特性的影响。通过考虑时域高斯噪声函数,我们比较了四种类型的LER:包括电阻-LER和间隔-LER,侧壁-LER和栅极-LER的梯形块体FinFET相对于不同翅片角度。阻力- ler和侧壁- ler对特性波动影响较大。对于每种类型的LER, Vth波动在鳍角之间具有可比性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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