Single-Poly Embedded NVM Solution for Analog Trimming and Code Storage Applications

Sung-Kun Park, Kwang-il Choi, Nam-Yoon Kim, Jung-Hoon Kim, Young-Jun Kwon, Kwangsik Ko, I. Cho, K. Yoo
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引用次数: 6

Abstract

We report a single-poly embedded nonvolatile memory (eNVM) solution for analog trimming and code storage applications using a 0.13-μm BCDMOS process. Each cell has its own merits and demerits, depending on structure and operation methods. For analog trimming purposes, a conventional n-well coupling Fowler-Nordheim tunneling cell with a large unit cell size of 88 μm2 is used. On the other hand, a select gate lateral coupling (SGLC) cell for code storage purposes has a much smaller unit cell size of 2.82 μm2, which is comparable to the size of SRAM. The SGLC cell is fabricated using a combination of only 1.5-V and 5-V transistor-related processes for channel hot electron injection programming. The SGLC cell exhibits a high programming speed of 100 μs and is over-erase-free, which is suitable for a NOR array structure. In addition, both cells also had a retention lifetime of more than 10 years. Thus, these cells can be fabricated to match the requirements of various eNVM applications.
模拟修剪和代码存储应用的单聚嵌入式NVM解决方案
我们报告了一种采用0.13 μm BCDMOS工艺的单聚嵌入式非易失性存储器(eNVM)解决方案,用于模拟修剪和代码存储应用。每个电池都有自己的优点和缺点,这取决于结构和操作方法。为了模拟修剪的目的,使用了传统的n阱耦合的Fowler-Nordheim隧穿电池,其单位尺寸为88 μm2。另一方面,用于代码存储的选择门横向耦合(SGLC)单元的单元尺寸要小得多,为2.82 μm2,与SRAM的大小相当。SGLC电池仅使用1.5 v和5 v晶体管相关工艺的组合来制造通道热电子注入编程。SGLC单元具有100 μs的高编程速度和无过擦除性,适用于NOR阵列结构。此外,这两种细胞的保留寿命都超过了10年。因此,可以制造这些单元以匹配各种eNVM应用程序的需求。
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