A. Ulusoy, Gang Liu, T. Feger, A. Trasser, H. Schumacher
{"title":"A narrow bandwidth microstrip bandpass filter suitable for system-on-package integration","authors":"A. Ulusoy, Gang Liu, T. Feger, A. Trasser, H. Schumacher","doi":"10.1109/MMW.2010.5605186","DOIUrl":null,"url":null,"abstract":"In this paper we present a compact microstrip bandpass filter using transmission zeros for narrowband characteristics, to be used in the carrier recovery path of a GB/s QPSK receiver. Several filters are designed operating at 20GHz with relative bandwidths (RBW) varying from 1.75% to 10%, and insertion losses varying from 3.5dB to 0.8 dB. A prototype filter is realized and good agreement between the measurement and simulation results is achieved. The applicability of the filter for system-on-package (SoP) integration is validated by a prototype wire bond connection to a thin film microstrip test structure on a Si substrate.","PeriodicalId":145274,"journal":{"name":"2010 10th Mediterranean Microwave Symposium","volume":"64 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-10-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 10th Mediterranean Microwave Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MMW.2010.5605186","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
In this paper we present a compact microstrip bandpass filter using transmission zeros for narrowband characteristics, to be used in the carrier recovery path of a GB/s QPSK receiver. Several filters are designed operating at 20GHz with relative bandwidths (RBW) varying from 1.75% to 10%, and insertion losses varying from 3.5dB to 0.8 dB. A prototype filter is realized and good agreement between the measurement and simulation results is achieved. The applicability of the filter for system-on-package (SoP) integration is validated by a prototype wire bond connection to a thin film microstrip test structure on a Si substrate.