Preparation of copper oxide films on alumina in a hot-target HiPIMS process

V. Lisenkov, A. Kaziev, D. G. Ageychenkov, A. Tumarkin, D. Kolodko, M. Kharkov, M. Kukushkina, M. Zaripova
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Abstract

Copper oxide thin films are widely used in many fields, such as solar cells, optoelectronics, catalysis, biosensors, photoelectrochemical sensors, supercapacitors, lithium-ion batteries, infrared photodetectors, electrochemical sensors, and gas sensors. They can also be applied to improve adhesion of comparatively thick copper coatings for ceramic PCB metallization. Here, we report the results of CuxOydeposition on alumina substrates in a hot-target HiPIMS discharge. The experiments were carried out in a magnetron deposition facility with thermally insulated copper target. CuxOy films with thickness around 2–3 μm were prepared. Their structure was studied with scanning electron microscope, and the composition was measured by EDS and XRD methods. The results showed predominant growth of stoichiometric CuO films. The correlations between deposition parameters and coating characteristics are discussed.
热靶HiPIMS工艺在氧化铝上制备氧化铜膜
氧化铜薄膜广泛应用于太阳能电池、光电子、催化、生物传感器、光电化学传感器、超级电容器、锂离子电池、红外探测器、电化学传感器、气体传感器等领域。它们还可以用于陶瓷PCB金属化中提高较厚铜涂层的附着力。在这里,我们报告了在热靶hiims放电中cuxy沉积在氧化铝衬底上的结果。实验在绝缘铜靶的磁控管沉积装置中进行。制备了厚度约为2 ~ 3 μm的CuxOy薄膜。用扫描电镜研究了它们的结构,用EDS和XRD测定了它们的组成。结果表明,化学计量CuO薄膜的生长占优势。讨论了沉积参数与涂层特性之间的关系。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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