Plug&Chip: A Framework for Supporting Rapid Prototyping of 3D Hybrid Virtual SoCs

D. Diamantopoulos, Efstathios Sotiriou-Xanthopoulos, K. Siozios, G. Economakos, D. Soudris
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引用次数: 6

Abstract

In the embedded system domain there is a continuous demand towards providing higher flexibility for application development. This trend strives for virtual prototyping solutions capable of performing fast system simulation. Among other benefits, such a solution supports concurrent hardware/software system design by enabling to start developing, testing, and validating the embedded software substantially earlier than has been possible in the past. Towards this direction, throughout this article we introduce a new framework, named Plug&Chip, targeting to support rapid prototyping of 2D and 3D digital systems. In contrast to other relevant approaches, our solution provides higher flexibility by enabling incremental system design, while also handling platforms developed with the usage of 3D integration technology.
插件与芯片:支持3D混合虚拟soc快速原型的框架
在嵌入式系统领域,不断有要求为应用程序开发提供更高的灵活性。这种趋势力求能够执行快速系统仿真的虚拟原型解决方案。在其他好处中,这样的解决方案支持并发硬件/软件系统设计,它允许比过去更早地开始开发、测试和验证嵌入式软件。朝着这个方向,在本文中,我们介绍了一个新的框架,名为Plug&Chip,旨在支持2D和3D数字系统的快速原型。与其他相关方法相比,我们的解决方案通过支持增量系统设计提供了更高的灵活性,同时还可以处理使用3D集成技术开发的平台。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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