Studies on the failure of components due to electrostatic discharge

Abstract

Electrostatic discharge (ESD) is a major cause of failure of semiconductor components. With the increasing complexity of devices, and higher component densities, device geometries have been shrinking and susceptibility to ESD damage has increased in the recent years. This paper discusses the ESD induced failure mechanisms in electronic systems and techniques to minimize failures at various stages using different techniques. Examples based on case studies carried out are also presented.