Distributed field plate effects in split-gate trench MOSFETs

R. Tambone, A. Ferrara, F. Magrini, A. Hoffmann, A. Wood, G. Noebauer, E. Gondro, R. Hueting
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Abstract

Fast electric transients can cause distributed effects inside trench MOSFETs possibly resulting in device failure. A new test structure to study those distributed effects, combined with a new Transmission-Line Pulse (TLP) setup, is presented. On-wafer TLP measurements are performed and combined with TCAD and SPICE simulations to predict the space and time evolution of the field plate potential during transients.
分栅沟槽mosfet中的分布场极板效应
快速电瞬变会在沟槽mosfet内部产生分布效应,可能导致器件失效。结合一种新的在线传输脉冲(TLP)装置,提出了一种新的测试结构来研究这些分布效应。在晶片上进行TLP测量,并结合TCAD和SPICE模拟来预测瞬态过程中场板电位的时空演变。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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