Modelling and optimization of GaN capped HEMTs

S. Faramehr, P. Igić, K. Kalna
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引用次数: 6

Abstract

The effect of GaN cap and its thickness on device performance is investigated using simulations by Silvaco Atlas toolbox. The simulations are based on meticulous calibration of a conventional, lateral, GaN capped, 1μm gate-length HEMT with a source-to-gate and gate-to-drain spacings of 2μm, and 3μm, respectively. The breakdown voltage of the GaN HEMT is improved by the aid of p-doped GaN cap and field plates to BV=630V showing an improvement of 540V in comparison to an unoptimized device. Furthermore, the possible creation of two dimensional hole gas (2DHG) at the interface of GaN cap and AlGaN barrier and its effect on the device behaviour is studied.
氮化镓封顶hemt的建模与优化
利用Silvaco Atlas工具箱模拟研究了氮化镓帽及其厚度对器件性能的影响。模拟是基于对传统的、横向的、氮化镓覆盖的、栅极长度为1μm的HEMT进行精确校准,其源到栅极和栅极到漏极的间距分别为2μm和3μm。在掺p的GaN帽和场极板的帮助下,GaN HEMT的击穿电压提高到BV=630V,比未优化的器件提高了540V。此外,还研究了在GaN帽和AlGaN势垒界面上可能产生的二维空穴气体(2DHG)及其对器件行为的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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