Signal integrity analysis of high speed USB IO and interconnection

2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2009-12-01 DOI:10.1109/EDAPS.2009.5403980

Tinghou Chen, P. Luo, Huili Fu

引用次数: 0

Abstract

This paper analyzed the signal integrity of high speed USB IO and IC package. Time domain modeling and measurement were studied and compared. The effect of the die junction temperature and the effect of process variations (typical and worst process parameters) were studied. Through the time domain signal integrity analysis, high signal quality and low cost design of high speed USB IO, package and PCB can be implemented.

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高速USB IO及互连的信号完整性分析

本文分析了高速USB IO和IC封装的信号完整性。对时域建模和时域测量进行了研究和比较。研究了模具结温的影响以及工艺参数变化(典型工艺参数和最差工艺参数)的影响。通过时域信号完整性分析，可以实现高速USB IO、封装和PCB的高信号质量和低成本设计。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)

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