Toward full crystal oscillator integration for RF applications

P. Tinguy, F. Lardet-Vieudrin, B. Dulmet, J. Leost, L. Couteleau
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Abstract

This paper presents the performances of an integrated oscillator working at 3.3V power supply for XO applications, extended to OCXO by digital selections. It is realized in a standard 0.35µm SiGe BiCMOS technology from austriamicrosystems AG®. Some experimental characterizations have been performed at 40 MHz and give good agreement with simulations. This die is then used to develop a miniaturized XO design on silicon substrate (8.5×8.5 mm2).
面向射频应用的全晶体振荡器集成
本文介绍了一种工作在3.3V电源下的集成振荡器的性能,并通过数字选择扩展到OCXO。它是在奥地利微系统公司的标准0.35 μ m SiGe BiCMOS技术中实现的。在40兆赫下进行了一些实验表征,结果与仿真结果吻合良好。然后使用该模具在硅衬底(8.5×8.5 mm2)上开发小型化XO设计。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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