High-κ Dielectrics on 20nm FDSOI FinFET: Study on Analog and RF Performance

G. P. Nikhil, Chinmay Dimri, P. K. Mohanty, R. Saha, S. Routray
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Abstract

In this paper, a detailed comparative study of RF and analog performance of FinFET structure is reported for two different gate dielectric materials - SiO2 and HfO2. Initially, the comparison of transfer characteristics of FinFET for both SiO2 and HfO2 is shown. The various analog parameters like transconductance (gm), transconductance generation factor (TGF), output conductance (gd), and intrinsic gain (gm/gd) are also reported for both the gate dielectric materials. Likewise, a comparative analysis of various RF parameters such as gate capacitance (CGG), cut-off frequency (ft), transconductance frequency product (TFP), gain frequency product (GFP) and gain transconductance frequency product (GTFP) are reported between SiO2 and HfO2. It is visualized that HfO2-based gate dielectric device provides better analog performance, whereas, the device with SiO2 as gate dielectric shows improved RF parameters
20nm FDSOI FinFET的高κ介电体:模拟和射频性能研究
本文对两种不同栅极介质材料SiO2和HfO2的FinFET结构的射频和模拟性能进行了详细的比较研究。首先,比较了SiO2和HfO2的FinFET的转移特性。还报道了两种栅极介质材料的各种模拟参数,如跨导(gm)、跨导产生因子(TGF)、输出电导(gd)和本征增益(gm/gd)。同样,对SiO2和HfO2之间的各种射频参数,如门电容(CGG)、截止频率(ft)、跨导频率积(TFP)、增益频率积(GFP)和增益跨导频率积(GTFP)进行了比较分析。由此可见,基于hfo2的栅极介质器件具有更好的模拟性能,而以SiO2为栅极介质的器件具有更好的射频参数
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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