K. Neumaier, Vaclav Valenta, Jonathan Chu, Yunpeng Xiao, S. Benczkowski, Bob Marquis, Sameer Yadav, Jonathan Harper, O. Picha, Rajani Thirukoluri, Roveendra Paul, Leon Zhang, Levan Bidzishvili, Thierry Bordignon, J. Victory
{"title":"A Virtual Prototyping System for Silicon-Carbide Power Modules","authors":"K. Neumaier, Vaclav Valenta, Jonathan Chu, Yunpeng Xiao, S. Benczkowski, Bob Marquis, Sameer Yadav, Jonathan Harper, O. Picha, Rajani Thirukoluri, Roveendra Paul, Leon Zhang, Levan Bidzishvili, Thierry Bordignon, J. Victory","doi":"10.1109/APEC43580.2023.10131595","DOIUrl":null,"url":null,"abstract":"This paper describes a holistic design and simulation tool deployed for virtual prototyping of SiC power modules. The power module designer proceeds from concept to virtual prototype in a logical and comprehensive flow. Starting with a simple 2D DXF of the Direct Bond Copper (DBC), the module is designed through die selection and placement, layer and material property declaration, electrical connectivity, and external port definition. Automated 3D model generation is carried out through advanced Ansys scripting techniques. Multiple levels of simulation and model generation are executed through Ansys Icepak, Ansys Q3D, and SPICE. The tool has been validated on multiple onsemi SiC industrial and automotive traction power modules.","PeriodicalId":151216,"journal":{"name":"2023 IEEE Applied Power Electronics Conference and Exposition (APEC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2023-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 IEEE Applied Power Electronics Conference and Exposition (APEC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APEC43580.2023.10131595","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper describes a holistic design and simulation tool deployed for virtual prototyping of SiC power modules. The power module designer proceeds from concept to virtual prototype in a logical and comprehensive flow. Starting with a simple 2D DXF of the Direct Bond Copper (DBC), the module is designed through die selection and placement, layer and material property declaration, electrical connectivity, and external port definition. Automated 3D model generation is carried out through advanced Ansys scripting techniques. Multiple levels of simulation and model generation are executed through Ansys Icepak, Ansys Q3D, and SPICE. The tool has been validated on multiple onsemi SiC industrial and automotive traction power modules.