A Virtual Prototyping System for Silicon-Carbide Power Modules

K. Neumaier, Vaclav Valenta, Jonathan Chu, Yunpeng Xiao, S. Benczkowski, Bob Marquis, Sameer Yadav, Jonathan Harper, O. Picha, Rajani Thirukoluri, Roveendra Paul, Leon Zhang, Levan Bidzishvili, Thierry Bordignon, J. Victory
{"title":"A Virtual Prototyping System for Silicon-Carbide Power Modules","authors":"K. Neumaier, Vaclav Valenta, Jonathan Chu, Yunpeng Xiao, S. Benczkowski, Bob Marquis, Sameer Yadav, Jonathan Harper, O. Picha, Rajani Thirukoluri, Roveendra Paul, Leon Zhang, Levan Bidzishvili, Thierry Bordignon, J. Victory","doi":"10.1109/APEC43580.2023.10131595","DOIUrl":null,"url":null,"abstract":"This paper describes a holistic design and simulation tool deployed for virtual prototyping of SiC power modules. The power module designer proceeds from concept to virtual prototype in a logical and comprehensive flow. Starting with a simple 2D DXF of the Direct Bond Copper (DBC), the module is designed through die selection and placement, layer and material property declaration, electrical connectivity, and external port definition. Automated 3D model generation is carried out through advanced Ansys scripting techniques. Multiple levels of simulation and model generation are executed through Ansys Icepak, Ansys Q3D, and SPICE. The tool has been validated on multiple onsemi SiC industrial and automotive traction power modules.","PeriodicalId":151216,"journal":{"name":"2023 IEEE Applied Power Electronics Conference and Exposition (APEC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2023-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 IEEE Applied Power Electronics Conference and Exposition (APEC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APEC43580.2023.10131595","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

This paper describes a holistic design and simulation tool deployed for virtual prototyping of SiC power modules. The power module designer proceeds from concept to virtual prototype in a logical and comprehensive flow. Starting with a simple 2D DXF of the Direct Bond Copper (DBC), the module is designed through die selection and placement, layer and material property declaration, electrical connectivity, and external port definition. Automated 3D model generation is carried out through advanced Ansys scripting techniques. Multiple levels of simulation and model generation are executed through Ansys Icepak, Ansys Q3D, and SPICE. The tool has been validated on multiple onsemi SiC industrial and automotive traction power modules.
碳化硅功率模块虚拟样机系统
本文介绍了一种用于SiC功率模块虚拟样机的整体设计与仿真工具。电源模块设计者从概念到虚拟样机的过程是一个逻辑完整的流程。从直接键合铜(DBC)的简单2D DXF开始,该模块通过模具选择和放置,层和材料属性声明,电气连接和外部端口定义进行设计。通过先进的Ansys脚本技术自动生成3D模型。通过Ansys Icepak, Ansys Q3D和SPICE执行多级仿真和模型生成。该工具已在多个onsemi SiC工业和汽车牵引电源模块上进行了验证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
文献相关原料
公司名称 产品信息 采购帮参考价格
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信