Study on the Sub-Threshold Margin Characteristics of the Extremely Scaled 3-D DRAM Cell Transistors

Abstract

This paper proposes an equivalent circuit model of 3-D DRAM cell transistors with recess gate and saddle fin structure for the first time. The model effectively characterize the sub-threshold and off margin behavior of the scaled DRAM cell transistor by considering the parasitic sub-channel and vertical transistor components into account. TCAD simulation and experimental data have confirmed the accuracy of the model. With the analysis made, we suggest a set of improvement method for the off margin characteristics engineering. These methods are believed to lead the continuous DRAM scaling, down to sub-10nm technology node.