{"title":"Design Optimization of High Voltage NPN ESD Protection Device in 130nm Power SOI Technology","authors":"Raunak Kumar, J. Zeng, K. Hwang, R. Gauthier","doi":"10.23919/IEDS48938.2021.9468844","DOIUrl":null,"url":null,"abstract":"A HV NPN ESD devices is evaluated in a 130nm Power SOI technology. Current flow and temperature distribution under ESD stress is investigated by TCAD and a new device architecture without STI is proposed. Non-uniform triggering issue is also investigated. Segment type layout design shows uniform triggering of multi-finger devices.","PeriodicalId":174954,"journal":{"name":"2020 International EOS/ESD Symposium on Design and System (IEDS)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-06-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 International EOS/ESD Symposium on Design and System (IEDS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/IEDS48938.2021.9468844","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
A HV NPN ESD devices is evaluated in a 130nm Power SOI technology. Current flow and temperature distribution under ESD stress is investigated by TCAD and a new device architecture without STI is proposed. Non-uniform triggering issue is also investigated. Segment type layout design shows uniform triggering of multi-finger devices.