IC/FPGA-Package-PCB Design Collaboration

Abstract

Advances in IC and FPGA speeds, pin counts and densities are on a collision course with an electronics company's need to design products in shorter times with optimal performance. Mr. Potts discusses new methodologies and design technology that spans from IC to package to PCB systems and enables concurrent design collaboration among the multiple design disciplines and organizations. He also talks to the need for more automation and functionality in the design of single IC and SiP packages, the ability to assign IC pins to optimize performance at the SiP and systems level, a method of implementing design collaboration between the IC, package and PCB systems' designers, and, revolutionary PCB design technology that could be applied to the design of ICs and their packages.