Compact modeling of noise in CMOS

A. Scholten, R. V. Langevelde, L. Tiemeijer, D. Klaassen
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引用次数: 21

Abstract

The physical background of the thermal noise equations of the PSP MOSFET model is presented. The PSP thermal noise model is shown to pass a number of proposed benchmark tests for MOSFET thermal noise. Without any fitting parameters, it is shown to predict with great accuracy a collection of experimental data on three modern CMOS technologies. The impact of device layout on noise properties is discussed and demonstrated experimentally
CMOS中噪声的紧凑建模
给出了PSP MOSFET模型热噪声方程的物理背景。结果表明,PSP热噪声模型通过了一系列MOSFET热噪声基准测试。在没有任何拟合参数的情况下,它可以很准确地预测三种现代CMOS技术的实验数据集。讨论了器件布局对噪声特性的影响,并进行了实验验证
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