Modeling of Microcapsule-based Self-healing Material to Achieve Better Recovering from Electrical Tree Defects

Abstract

Microcapsule-based self-healing material has been developed to repair the electrical tree defect, which is regarded as the major factor that results in electrical damage of polymer insulations. Compared to heal mechanical cracks, it is more complex to introduce self-healing capacity to insulation material since the material requires higher property and the healing process faces more severe conditions. In this work, microcapsule-based self-healing insulating material containing electrical tree channels is modeled. The mechanism by which self-healing material heals the electrical tree and recovers the dielectric property is demonstrated by simulating the self-healing material with healing agent before filling, after filling and after cured. The results of the simulation give guidance for the design of those material to achieve better healing performance.