Combined SRAM read/write assist techniques for near/sub-threshold voltage operation

Farah B. Yahya, H. Patel, V. Chandra, B. Calhoun
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引用次数: 8

Abstract

This paper investigates the use of combined read and write assist techniques to reduce the minimum operating voltage (VMIN) of the 6T SRAM bit-cell. While write failures initially limit VMIN, applying write assist introduces row and column half-select failures. Thus, read and write assist must be combined to allow scaling VMIN down to near/sub threshold voltages. We find that combining negative bitline (BL) for write assist with array VDD boosting for read assist is most effective for reducing the array VMIN and eliminating half-select failures for commercial 130nm and sub-20nm FinFET technologies across different process corners and temperatures. The proposed combination results in the highest reduction in SRAM VMIN (to 300mV for FinFET and to 600mV for 130nm CMOS). This paper also shows that controlling the degree of applied assist based on the chip corner will allow further reductions in VMIN for the 130nm CMOS (to 450mV) and the required assist needed to achieve VMIN for both the FinFET and the 130nm bit-cells.
组合式SRAM读/写辅助技术,用于接近/亚阈值电压操作
本文研究了使用组合式读写辅助技术来降低6T SRAM位单元的最小工作电压(VMIN)。虽然写失败最初会限制VMIN,但应用写辅助会导致行和列半选择失败。因此,读写辅助必须结合起来,以允许将VMIN降低到接近/亚阈值电压。我们发现,将用于写辅助的负位线(BL)与用于读辅助的阵列VDD增强相结合,对于降低阵列VMIN和消除跨不同工艺角和温度的商用130nm和sub-20nm FinFET技术的半选择故障最为有效。所提出的组合导致SRAM VMIN的最大降低(FinFET为300mV, 130nm CMOS为600mV)。本文还表明,基于芯片角控制应用辅助的程度将进一步降低130nm CMOS的VMIN(至450mV),以及FinFET和130nm位单元实现VMIN所需的辅助。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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