Hira Naz, Umair Naeem, M.Fahad Farooqui, Musaddiq Ali Shah
{"title":"Thermal considerations in high power microwave amplifiers design","authors":"Hira Naz, Umair Naeem, M.Fahad Farooqui, Musaddiq Ali Shah","doi":"10.1109/IBCAST.2012.6177541","DOIUrl":null,"url":null,"abstract":"The paper describes major thermal issues designers come across while designing high power solid state amplifiers for satellite applications. Various methods to minimize heat and temperature rise will be presented which consequently increases the efficiency of any high power amplifier. The choice of components, materials, layout and fixation techniques will also be highlighted in detail. Different design considerations for heat sinks and use of thermal conductors in designing of high power amplifiers will also be included in the presented work.","PeriodicalId":251584,"journal":{"name":"Proceedings of 2012 9th International Bhurban Conference on Applied Sciences & Technology (IBCAST)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 2012 9th International Bhurban Conference on Applied Sciences & Technology (IBCAST)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IBCAST.2012.6177541","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
The paper describes major thermal issues designers come across while designing high power solid state amplifiers for satellite applications. Various methods to minimize heat and temperature rise will be presented which consequently increases the efficiency of any high power amplifier. The choice of components, materials, layout and fixation techniques will also be highlighted in detail. Different design considerations for heat sinks and use of thermal conductors in designing of high power amplifiers will also be included in the presented work.