A thermal and congestion driven global router for 3D integrated circuits

Abstract

During recent days, the large problem space of very large scale integrated (VLSI) circuits has led global routing problem to a NP Complete one. With the advent of three dimensional integrated circuits (3D IC) the problem has become more complex. In this paper, a multi-objective global routing technique is formulated using fuzzy logic to get rid of the limitations of deterministic approaches. During global routing the decision is taken from a fuzzy logic expert system depending upon some generated pre-routing guiding information. Proposed approach is mainly focused on the modern generation 3D ICs. This primary work is mainly incorporated in the standard cell design for 3D ICs. A two-pin global router tool is designed based on the proposed algorithm resulting 85-97% routability in negligible time for ISPD'98 benchmarks.