Hardware implementations and performance assessments of a DC magnetron sputter for enhanced depositions

Abstract

To refine the substrate deposition results, some supplementary mechanical adjustments can be designed and implemented onto the existing DC magnetron sputters (MS). By the assistances of these attachments along with proper controls on the magnetic and electric field paths inside the vacuum chamber, results indicated that more target atoms can be sputtered and smoother depositions on the substrate surface can be achieved. Based on appropriate performance index selections, operations of the DC MS were thoroughly investigated. Selected regions on the deposited substrate surface will be probed with thickness gauge and atomic force microscopy, thus the operational performances of the DC MS with structural refinements can be assessed and the desired improvements can then be systematically validated.