On the Stress Measurement Method Using Slip Lines in Copper Foil with Grown Grain Structure : Solid-Mechanics, Strength of Materials

S. Kitaoka, K. Ohshima
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引用次数: 4

Abstract

By observing slip lines in a copper foil with grown grain structure, the method of measuring cyclic stresses acting on machine elements is studied. The features and distinction of this method in comparison with the copper electroplating method or the method using a recrystallized foil are examined. This method is superior to the method using a recrystallized foil from the standpoint of ease of measurement, and its strain sensitivity is much higher than that of the electroplating method. As an application of this method, the stress concentration factors in various types of circular shafts with a flat part under cyclic torsion are obtained, with the results showing good agreement with those obtained previously.
用滑移线测量生长晶粒结构铜箔应力的方法:固体力学,材料强度
通过观察长晶粒结构铜箔的滑移线,研究了机械元件循环应力的测量方法。比较了该方法与镀铜法或用再结晶箔法的特点和区别。从测量方便的角度来看,该方法优于使用再结晶箔的方法,其应变灵敏度远高于电镀方法。作为该方法的应用,得到了不同类型的带扁件的圆轴在循环扭转作用下的应力集中系数,结果与前人的计算结果吻合较好。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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