Open HW, open design SW, and the VC ecosystem dilemma

J. Carballo
{"title":"Open HW, open design SW, and the VC ecosystem dilemma","authors":"J. Carballo","doi":"10.1109/IWSOC.2005.88","DOIUrl":null,"url":null,"abstract":"The open model for solutions development is quickly extending from software to other technology areas, such as hardware and services. Specifically, just as open source has spawned a revolution in the technical, business, and legal model for software, open hardware will provide a swell of collaborative innovation that will create entirely new markets and provide significant business benefits to the most creative, most reliable, and most adaptable semiconductor, EDA, system-on-chip (SoC) and systems houses. The open-source software stack with Linux as its cornerstone is increasingly the preferred choice for newly venture-funded companies. Open hardware will also change the world of SoC venture investing. While the degree of openness and the business model may vary, SoC products have to be increasingly developed through a collaborative model that helps assemble IP blocks and services from multiple sources. In this paper we describe the open standards model for hardware, chip, and tool innovation, and we argue the a systematic IP valuation methodology will help the success of this environment, in that it will allow each member of the value chain - especially small VC-backed companies - to capture enough value to desire to participate.","PeriodicalId":328550,"journal":{"name":"Fifth International Workshop on System-on-Chip for Real-Time Applications (IWSOC'05)","volume":"96 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-07-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Fifth International Workshop on System-on-Chip for Real-Time Applications (IWSOC'05)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IWSOC.2005.88","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

The open model for solutions development is quickly extending from software to other technology areas, such as hardware and services. Specifically, just as open source has spawned a revolution in the technical, business, and legal model for software, open hardware will provide a swell of collaborative innovation that will create entirely new markets and provide significant business benefits to the most creative, most reliable, and most adaptable semiconductor, EDA, system-on-chip (SoC) and systems houses. The open-source software stack with Linux as its cornerstone is increasingly the preferred choice for newly venture-funded companies. Open hardware will also change the world of SoC venture investing. While the degree of openness and the business model may vary, SoC products have to be increasingly developed through a collaborative model that helps assemble IP blocks and services from multiple sources. In this paper we describe the open standards model for hardware, chip, and tool innovation, and we argue the a systematic IP valuation methodology will help the success of this environment, in that it will allow each member of the value chain - especially small VC-backed companies - to capture enough value to desire to participate.
开放硬件,开放设计软件,以及VC生态系统的困境
解决方案开发的开放模型正迅速从软件扩展到其他技术领域,例如硬件和服务。具体来说,就像开源在软件的技术、商业和法律模式上引发了一场革命一样,开放硬件将提供大量的协作创新,这将创造全新的市场,并为最具创造性、最可靠、最具适应性的半导体、EDA、片上系统(SoC)和系统厂商提供重大的商业利益。以Linux为基础的开源软件越来越成为新成立的风险投资公司的首选。开放硬件也将改变SoC风险投资的世界。虽然开放程度和商业模式可能会有所不同,但SoC产品必须越来越多地通过协作模式来开发,这种模式有助于组装来自多个来源的IP块和服务。在本文中,我们描述了硬件,芯片和工具创新的开放标准模型,我们认为系统的知识产权评估方法将有助于这种环境的成功,因为它将允许价值链的每个成员-特别是小型风投支持的公司-获得足够的价值,以渴望参与。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信