Charge transport in silicon nitride/silicon oxide double layers

X. Zhang, G. Sessler
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引用次数: 4

Abstract

Charge transport was studied in double layers of 150 nm silicon nitride and 300 nm silicon oxide on silicon substrate by determining the location of the charge centroid (mean charge depth) with a new method based on the evaluation of capacitance-voltage data in conjunction with surface potential measurements. The samples were charged at room temperature on their open nitride surface to potentials of about 100 V with a corona process. Measurements of the location of the charge centroid were performed after annealing periods at temperatures up to 600/spl deg/C. The results show that positive charge is relatively immobile at the nitride surface at temperatures up to 200/spl deg/C; at 400/spl deg/C, it drifts through the nitride within hours to be trapped at the nitride/oxide interface. The charge is released from these traps at about 500/spl deg/C when it drifts to the substrate. Negative charge is also immobile at 200/spl deg/C but drifts at 400/spl deg/C through the entire double layer.
氮化硅/氧化硅双层中的电荷输运
采用基于电容电压数据评估和表面电位测量的新方法确定电荷质心位置(平均电荷深度),研究了硅衬底上150 nm氮化硅和300 nm氧化硅双层层的电荷输运。在室温下,用电晕法将样品在开放的氮化物表面充电至约100 V的电势。电荷质心位置的测量是在温度高达600/spl℃的退火阶段后进行的。结果表明:当温度高达200℃/spl℃时,正电荷在氮化物表面相对不动;在400/spl℃时,它在数小时内穿过氮化物并被困在氮化物/氧化物界面。当电荷漂移到衬底时,电荷以约500/spl度/C的速度从这些陷阱中释放出来。负电荷在200/spl度/C时也不移动,但在400/spl度/C时通过整个双层漂移。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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