Technological Stresses in the System of High-Voltage Mica Insulation

Abstract

The study is devoted to problem of creation monolithic mica insulation for busbars and stator windings of electric machines, which is created from tape materials on Resin Rich (RR) technology. Technological stresses arising in process of thermal pressing multilayered thermosetting mica insulation can lead to emerging of defects as peeling of insulation from conductor or reduction of adhesion between layers of insulation. Calculation of technological stresses is provided in program COMSOL MULTIPHYSICS in transverse section with changing of configuration and material of conductor. Influence of curing temperature of thermal pressing process to value of this stresses is considered. Estimated data is compared with experimental values of adhesive durability, which is got by different tests. It lets to estimate possibility of defects arising in insulation system in manufacturing.