{"title":"The modular design and thermal analysis of modularized APF","authors":"Yifan Wang, Q. Yang, Jinlong Gong","doi":"10.1109/CIEEC.2018.8745956","DOIUrl":null,"url":null,"abstract":"The structure and thermal design are related to both the reliability and the power density of the modularized APF. It is very important for modularized APF. In this paper, the APF modular is designed to be drawer type based on the guarantee of heat dissipation. The structure and thermal design are accomplished. The loss and thermal of the power module is given and analyzed, A fluid-thermal coupling Computational Fluid Dynamics (CFD) simulation method is given on the forced air-cooling condition. The results of the temperature rise simulation are consistent to that of the theory calculation, which show the module has enough heat dissipation margins.","PeriodicalId":329285,"journal":{"name":"2018 IEEE 2nd International Electrical and Energy Conference (CIEEC)","volume":"64 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE 2nd International Electrical and Energy Conference (CIEEC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CIEEC.2018.8745956","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
The structure and thermal design are related to both the reliability and the power density of the modularized APF. It is very important for modularized APF. In this paper, the APF modular is designed to be drawer type based on the guarantee of heat dissipation. The structure and thermal design are accomplished. The loss and thermal of the power module is given and analyzed, A fluid-thermal coupling Computational Fluid Dynamics (CFD) simulation method is given on the forced air-cooling condition. The results of the temperature rise simulation are consistent to that of the theory calculation, which show the module has enough heat dissipation margins.