Yield analysis for a large-area analog X-ray sensor array

Abstract

A small-scale CMOS-based radiographic X-ray image sensor array has been developed for nondestructive test and medical imaging. The authors present an analysis of tradeoffs between yield and area of a scaled up large-area X-ray sensor design. The X-ray sensor array can tolerate a low level of faults in the individual pixel cells and these faults can be corrected by imaging software. However, global signal line faults cause X-ray sensor failures. This work models X-ray sensor yield in a 12-layer analog CMOS process for three possible overall defect densities, 1.5 defects/cm, 1.0 defects/cm, and 0.75 defects/cm. It is shown that the X-ray sensor is more manufacturable than a charge coupled device (CCD) array of the same area.<>