Investigation on thermal properties of substrates for printed electronics

C. Ionescu, D. Bonfert, M. Branzei
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引用次数: 6

Abstract

Printed Electronics is today an emerging technology with potential for many applications, having as target the low cost market. Although many applications are operating with low level of currents and voltages and hence thermal issues don't arise, there are some applications that imply thermal stressing of these substrates, for instance gas sensors. This paper presents an essay for establishing a measurement procedure for thermophysical properties of thin polymer foils, more precisely the thermal conductivity in steady state thermal regime [1]. For comparison, thermal conductivity of substrates with known thermal conductivity is measured supplemental, using a laboratory thermal conductivity meter.
印刷电子衬底热性能研究
印刷电子技术是当今具有许多应用潜力的新兴技术,其目标是低成本市场。虽然许多应用都是在低电流和低电压下工作,因此不会出现热问题,但也有一些应用意味着这些基板的热应力,例如气体传感器。本文建立了一种测量薄聚合物箔热物理性能的方法,更准确地说,是测量稳态热态[1]下的导热系数。为了比较,已知导热系数的基材的导热系数是补充测量的,使用实验室导热系数计。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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