Design and characterization of STI compatible high-voltage NMOS and PMOS devices in standard CMOS process

Xiaolian Han, Chihao Xu
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引用次数: 3

Abstract

This paper presents the design of High-Voltage NMOS and PMOS devices with STI (shallow trench isolation) technology fully compatible with a standard 0.25 mum/5 V CMOS process technology. Breakdown voltages of 35 V for n-channel with a specific on resistance of 1.96 mOmega.cm2 and -45 V for p-channel with a specific on-resistance of 8.73 mOmega.cm2 have been achieved without any modification of existing standard CMOS process.
在标准CMOS制程中,STI相容高压NMOS与PMOS元件的设计与表征
本文介绍了采用STI(浅沟槽隔离)技术的高压NMOS和PMOS器件的设计,该技术完全兼容标准的0.25 μ m/5 V CMOS工艺技术。n通道击穿电压为35v,比电阻为1.96兆欧。cm2和-45 V的p通道,比导通电阻为8.73兆欧。在没有对现有标准CMOS工艺进行任何修改的情况下实现了cm2。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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